End-to-end turnkey ASIC development — chip architecture, RTL & AMS design, UVM verification, RTL2GDSII, tape-out, fabrication, test and volume production — owned by one accountable team. You keep 100% of the IP.
Most ASIC services stop at GDSII and hand you a foundry phone number. Here is exactly where our responsibility begins — and where yours ends.
Every stage ends in a sign-off gate that you approve before we proceed. You always know where your chip is, what it has cost, and what happens next — a gated program you can put in front of your board.
Your product requirements become a chip specification — PPA targets, process node, packaging and a unit-cost model. We tell you honestly if an FPGA beats an ASIC at your volumes.
Block partitioning, memory hierarchy, clock and power domains, and the digital-analog boundary — modelled and budgeted before a single line of RTL exists.
Digital RTL and full-custom analog developed in parallel — data converters, PLLs, power management, RF front-ends and high-speed interfaces.
UVM coverage-driven closure, formal methods, ZeBu and Palladium emulation, and FPGA prototyping for early software bring-up — because a respin costs six months and seven figures.
Synthesis, place & route, timing, power and IR closure, DFT insertion and physical verification — GDSII delivered DRC/LVS clean to the foundry.
Wafer fabrication managed at tier-1 foundries and packaging at qualified OSATs — QFN through advanced flip-chip and SiP — with wafer sort and bring-up boards ready for first silicon.
Silicon characterization across voltage and temperature corners, production ATE program development, and qualification to whatever standard your market demands.
We run your supply chain — wafer starts, assembly, test and logistics — and keep the part alive for the decade your product ships, including yield improvement and cost-down revisions.
The reason to buy turnkey isn't the price of engineering hours. It's that the three things that quietly kill chip programs stop being your problem.
Gated, coverage-driven verification exists to prevent it. When a respin traces to our design work, the contract says we correct it at our cost — agreed before we start, not argued afterwards.
Fixed-price milestones tied to gates. Our team is already ramped — EDA licences, foundry accounts and silicon-proven IP in place — so month one is engineering, not recruitment.
No hand-off between a design house, a fab broker and a test house — the seams where programs quietly lose quarters. One team, one plan, one accountable party.
A typical mid-complexity mixed-signal program, indexed against an in-house build. Your feasibility study replaces these bars with your real numbers.
Silicon-proven IP, established foundry access, 200+ engineers already ramped. You pay for milestones, not infrastructure.
Recruitment, EDA licences, foundry onboarding, IP licensing and vendor coordination — all before the first gate is designed.
Engineering · Hyderabad
While you'd spend 12–18 months recruiting a chip team, ours starts in two weeks — EDA flow, foundry access and silicon-proven IP already in place.
Die-level design
Post-silicon validation
UVM verification
Not just chips in a tray. Everything created for your program transfers to you, so you are never locked to us.
Some customers arrive with an idea. Others have RTL and need someone to carry it to production. All three models run on the same gated milestones.
Hand us a product spec. Receive qualified chips at your dock. We own every stage in between under a single contract.
Your architects, our execution muscle — or the reverse. We take AMS, verification, DFT or physical design as a clean scope.
Physical design, tape-out, qualification and a supply chain that scales — for teams holding RTL but no path to silicon.
Turnkey programs tuned to the qualification, lifetime and cost realities of each domain — not a one-size flow.
NRE typically runs from a few hundred thousand dollars for a mature-node mixed-signal ASIC to several million for an advanced-node SoC — driven by node, die size, IP content and qualification level. Our free 21-day feasibility study quantifies NRE and unit cost at your target volumes, so you decide with real numbers instead of a range.
A typical program runs 12–18 months: 6–9 months to tape-out, 3–4 months of fabrication and packaging, then 3–5 months of validation and qualification. Mature nodes reusing proven IP land at the fast end; automotive qualification adds time at the far end.
As a rule of thumb, above roughly 50,000–100,000 lifetime units on mature nodes — and often earlier when power, size or BOM integration matter, since one ASIC frequently replaces an FPGA plus several discrete components. Your feasibility study includes a break-even model, and we'll say plainly if an FPGA is the better answer for you.
You do — completely. All RTL, GDSII, test programs and documentation created for your program are your property under the contract. Where our pre-existing silicon-proven IP saves you time, you receive a perpetual royalty-free licence for your product. Third-party design-database escrow is available.
Our gated, coverage-driven verification methodology exists to prevent exactly that, and the large majority of our designs work on first silicon. When a respin is needed, responsibility is defined in the contract up front: defects traceable to our design work are corrected at our cost. You never discover risk allocation after the fact.
We deliver designs across mature and advanced nodes through established tier-1 foundry relationships and their MPW shuttle programs, with qualified OSAT partners for packaging and test. Node selection is an engineering decision we make with you during feasibility — driven by your performance, power and unit-cost targets.
Yes — rescue and hand-off programs are regular work for us. We audit the existing design database, deliver a gap report with an honest completion estimate, then carry the design through tape-out, qualification and production under our design-to-production model.
A mutual NDA is signed before any technical exchange. Programs run in access-controlled project rooms with need-to-know data segregation, and your program is never staffed alongside a direct competitor's.
Tell us about your chip. You'll receive a node recommendation, block-level architecture sketch, die-size estimate, NRE breakdown and unit cost at your volumes — no commitment required.
Let’s Build Your Next Chip Together.