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Simplifying IT
for a complex world.
Platform partnerships
- AWS
- Google Cloud
- Microsoft
- Salesforce
System Design Engineering
Model the SoC
Before You
Build It.
Silicon Patterns creates high-fidelity SystemC Digital Twins of your SoC — enabling parallel software development, risk-free validation, and faster time-to-market before a single gate is synthesized.
3×
Faster SW Bring-up
60%
Risk Reduction
0
Respin Cost
What We Deliver
Build the Virtual SoC First — Then Go Silicon
Our SystemC Digital Twin methodology creates a cycle-approximate or transaction-accurate virtual model of your SoC. Software teams start development months earlier. Hardware risks are caught before tape-out. The result: fewer respins, lower cost, and faster market entry.
SystemC TLM 2.0 models for CPU, memory, DMA, peripherals, and custom IPs
Virtual Platform (VP) delivery for early software bring-up and OS boot
Cycle-approximate performance modeling for bandwidth and latency analysis
Power modeling and thermal analysis at the system level
Digital twin-to-RTL consistency verification
Silicon IP portfolio: RTL, Analog, and Verification IPs ready to integrate
Modeling Levels
TLM (Transaction Level)
Fastest simulation, ideal for early SW bring-up and architecture exploration
Cycle-Approximate
Performance modeling, cache simulation, DMA timing validation
Pin-Accurate
Pre-silicon validation, driver verification, interrupt testing
Traditional Approach
SW team waits for silicon — 12+ months delay
Design bugs found late — expensive respins
Architecture validated only after RTL is complete
Power budgets estimated, not simulated
Parallel development impossible without hardware
With Digital Twin
SW development starts day 1 — parallel to HW
Architecture bugs caught before any RTL is written
Performance modeled and validated in weeks
Power simulated at system level before tapeout
Eliminates or minimizes silicon respins
Core Services
Full System Design Engineering Portfolio
SystemC / TLM 2.0 Modeling
Full SoC virtual platform development in SystemC with TLM 2.0 sockets — CPU cores, bus fabric, memory controllers, DMA, and peripherals.
Performance Modeling
Cycle-approximate performance simulation — bandwidth analysis, latency profiling, memory bottleneck identification, and architecture trade-off exploration.
SoC Architecture Design
Chip-level architecture exploration, IP selection, interface definition, clock/reset topology, power domain planning, and die-size estimation.
Silicon IP Portfolio
Access to Silicon Patterns' library of proven RTL, Analog, and Verification IPs — PCIe, DDR, USB, Ethernet, DSP, and more — production-ready.
Power Architecture
System-level power modeling, DVFS planning, power domain isolation strategies, and leakage analysis before committing to RTL implementation.
Emulation & Prototyping
FPGA-based SoC prototyping, Veloce/Palladium emulation setup, and hardware/software co-validation for pre-silicon confidence.
Our Process
From Spec to Virtual SoC in Weeks
01
Spec Ingestion
Review hardware specification, identify key performance indicators, power targets, and SW requirements that the digital twin must model.
02
Architecture & Model Plan
Define TLM abstraction level, block list, interface contracts, and simulation infrastructure — aligned with your project timeline and goals.
03
Digital Twin Build
Develop SystemC models block by block, integrate into a virtual platform, and validate against reference models or existing silicon data.
04
SW Handoff & Maintenance
Deliver the virtual platform to your SW team, provide integration support, and maintain model accuracy as the hardware design evolves.
Ready to Start?
Build Faster, Smarter Silicon with Digital Twins
Let us model your SoC in SystemC — so your software team never waits for hardware again.
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